Blog Review: Aug. 7

Synopsys’ Jyotika Athavale and Randy Fish examine the issue of silent data corruption attributable to difficult-to-detect {hardware} defects that trigger unnoticed errors within the information being processed and is turning into an more and more urgent downside as computing scales massively at a fast tempo with the calls for of AI.

Siemens’ Keith Felton suggests adopting physical design reuse circuits to offer a extra sturdy and dependable strategy to IP reuse for complicated IC package deal designs, enabling dynamic web propagation, fast ECOs, golden supply administration, and design modularity.

Cadence’s Jayne Guimaraes checks out Near End Loopback (NELB), a characteristic launched by Intel’s PHY Interface spec revision 6.1 that permits the IP to check transmitted towards acquired information to facilitate testing the PHY system for high-volume manufacturing.

Keysight’s Roberto Piacentini Filho presents a process framework for holistically managing all of the levels of system growth, bringing collectively necessities administration, IC design levels, implementation levels, verification, testing levels, manufacturing, change administration, revision management, and bug monitoring.

Arm’s Zenon Xiu introduces a few of the directions that the Arm Scalable Matrix Extension provides, together with ones that accumulate or subtract the outer product of two vectors right into a ZA tile, add a vector horizontally or vertically to a ZA tile, and add a a number of of the vector dimension in Streaming SVE mode to a scalar register.

Ansys’ Aliyah Mallak checks out how computational fluid dynamics and cloud computing are used to construct a virtual wind tunnel and optimize the aerodynamics of bikes, helmets, and different gear.

SEMI’s John Cooney listens in as U.S. Below Secretary of State Jose Fernandez explains why forming partnerships is important to deal with vulnerabilities and create stable supply chains for minerals vital to semiconductor manufacturing, like germanium, gallium, arsenic, indium, and uncommon earth components.

Plus, try the blogs featured within the newest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Siemens’ Lee Wang explains why 3D stacked die for automotive want die-level thermal analysis.

Rambus’ Ajay Kapoor factors to the necessity to secure data even when it’s getting used.

Synopsys’ Hezi Saar explains what’s wanted for heterogeneous, centralized automotive zonal architectures.

Flex Logix’s Jayson Bethurem seems to be at cost- and memory-saving methods to optimize AI performance.

Infineon’s Tammie Bard exhibits how two small capacitors and a resistor can clear up some thorny point-of-load problems.

Renesas’ Jacques Bittar particulars the affect of recent automotive safety features on information.

TXOne’s Darren Chung zeroes in on what protection contractors want to guard towards, reply to, and recuperate from cyber threats.

Cadence’s Reela Samuel lays out the role of CFD in holding the Olympic Torch lit.

Onto Innovation’s Prasad Bachiraju explains the right way to flip reactive root trigger analytics into proactive monitoring to keep away from the development of faulty die within the pursuit of zero defect manufacturing.

Synopsys’ Faisal Goriawalla digs into HBM4 test challenges and why it’s essential to detect defects earlier than system failure.

Teradyne’s Fisher Zhang discusses the auto trade’s push in the direction of smaller course of nodes and the challenges that necessitate early and continuous engagement with testing.

Advantest’s Ira Leventhal exhibits how AI and ML algorithms are used to identify patterns and anomalies that may not be found by human testers or conventional strategies.