Samsung Electronics Begins Mass Production of Industry’s Thinnest LPDDR5X DRAM Packages for On-Device AI – Samsung Global Newsroom
Samsung’s compact LPDDR5X DRAM packages measure 0.65mm excessive,
permitting enhanced thermal management appropriate for on-device AI cellular purposes
The LPDDR bundle stacks 4 layers of 12nm-class DRAM die,
lowering thickness and bettering warmth resistance whereas growing density
Samsung Electronics, the world chief in superior reminiscence know-how, as we speak introduced it has begun mass manufacturing for the trade’s thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages, solidifying its management within the low-power DRAM market.
Leveraging its intensive experience in chip packaging, Samsung is ready to ship ultra-slim LPDDR5X DRAM packages that may create extra area inside cellular units, facilitating higher airflow. This helps simpler thermal management, an element that’s turning into more and more important particularly for high-performance purposes with superior options similar to on-device AI.
“Samsung’s LPDDR5X DRAM units a brand new normal for high-performance on-device AI options, providing not solely superior LPDDR efficiency but additionally superior thermal administration in an ultra-compact bundle,” mentioned YongCheol Bae, Govt Vice President of Reminiscence Product Planning at Samsung Electronics. “We’re dedicated to steady innovation via shut collaboration with our prospects, delivering options that meet the longer term wants of the low-power DRAM market.”
With the brand new LPDDR5X DRAM packages, Samsung presents the trade’s thinnest 12 nm-class LPDDR DRAM in a 4-stack construction,1 lowering the thickness by roughly 9% and bettering warmth resistance by about 21.2%, in comparison with the earlier technology product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 methods, the brand new LPDDR DRAM bundle is as skinny as a fingernail at 0.65 millimeters (mm), the thinnest amongst current LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 course of can also be used to attenuate the bundle peak.
Samsung plans to proceed increasing the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to cellular processor makers in addition to cellular gadget producers. As demand for high-performance, high-density cellular reminiscence options in smaller bundle sizes continues to develop, the corporate plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future units.
1 Construction with 4 layers packaged collectively, and every layer consists of two LPDDR DRAMs.
2 Materials that protects semiconductor circuits from varied exterior environments similar to warmth, impacts, and moisture.
3 Grinding the bottom of a wafer.
